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Cooler Master MasterAir MA824 Stealth Dual Tower CPU Air Cooler, 8 Heat Pipes, Dual Mobius 120|130mmFans, Nickel-Plated Copper Base - Image 2

Cooler Master MasterAir MA824 Stealth Dual Tower CPU Air Cooler, 8 Heat Pipes, Dual Mobius 120|130mmFans, Nickel-Plated Copper Base - Image 3

Cooler Master MasterAir MA824 Stealth Dual Tower CPU Air Cooler, 8 Heat Pipes, Dual Mobius 120|130mmFans, Nickel-Plated Copper Base - Image 4

Cooler Master MasterAir MA824 Stealth Dual Tower CPU Air Cooler, 8 Heat Pipes, Dual Mobius 120|130mmFans, Nickel-Plated Copper Base

Name: Buy Cooler Master MasterAir MA824 Stealth Dual Tower CPU Air Cooler, 8 Heat Pipes, Dual Mobius 120|130mmFans, Nickel-Plated Copper Base at Best Price in Pakistan | PlayTech
SKU: MasterAir MA824 Stealth
Price: 22999 PKR
Availability: OutOfStock

Warranty : 06 Months

Model: MasterAir MA824 Stealth

Note: Shipping and Packing Charges are in advance. We do not send parcel without advance shipping charges you will get message on whatsapp regarding advance shipping and packing charges. thanks

Original price was: ₨ 28,999.Current price is: ₨ 22,999.

Out of stock

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SKU: MasterAir MA824 Stealth Category: CPU Coolers and Heatsinks

Description

Cooler Master MasterAir MA824 Stealth Dual Tower CPU Air Cooler

Make It Yours

We’re all about the things that make building a PC such a rewarding experience. The sense of achievement. The joy of making and creating something uniquely yours in form and function and, of course, the thrill of bringing your creation to life without melting your components.

MasterAir MA824 Stealth

Eight Recreated

Cooler Master unveils its flagship air cooler, the MasterAir MA824 Stealth. It embodies the Stealth identity with sleek blackout accents design. The redesigned dual tower incorporates 8 Superconductive Composite Heat Pipes, featuring variable thicknesses for heat dissipation. Upgraded Mobius 120 fan, the staggered Push-Pull setup, coupled with a high-performance 135mm fan, for an exceptional cooling performance. The nickel-plated copper base provides complete and seamless contact with the CPU.

8 In-house Designed Superconductive Composite Heat Pipes
Dual Tower Push-Pull Setup
8 Heat Pipe Array
Nickel-Plated Copper Base
Dual 135mm & 120mm Mobius Fans
Maximum RAM Clearance
Latest Socket Compatibility
AMDAM5/AM4, Intel LGA 1700/1200/115X


8 Superconductive Composite Heat Pipes 8 In-house designed superconductive composite heat pipes utilize a groove and powder wick structure with dual variable thickness for optimal heat transfer efficiency.	Performance Dual Tower The redesigned dual tower maximizes performance and surface area by incorporating optimized fin density and thickness.	8 Heat Pipe Array An optimized layout comprising of 8 heat pipes ensures efficient heat transfer across the entire fin area for effective dissipation.	Expanded Copper Base The expanded nickel-plated copper base ensures seamless contact and complete coverage, targeting all heat zones. Minimized base layer thickness enhances heat conductivity, reduces cooler height, and improves case compatibility.


Dual Mobius Fans Equipped with dual variable Mobius fans, providing exceptional silence without compromising performance.	Staggered Dual Fan Setup Staggered arrangement of 120mm and 135mm Mobius fans creates the ultimate Push-Pull setup, ensuring optimal airflow and air pressure for maximizing heat dissipation.	Maximum RAM Clearance 120mm Mobius fan provides 42mm of RAM clearance to fit a wider range of builds without sacrificing performance.	Latest Socket Compatibility Redesigned brackets simplify installation on the latest available AM5 and LGA1700 platforms.

Additional information

Weight	1 kg
Color	Black

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Key Features

• 8 In-house Designed Superconductive Composite Heat Pipes: 8 In-house designed superconductive composite heat pipes utilize a groove and powder wick structure with dual variable thickness for optimal heat transfer efficiency.
• Performance Dual Tower: The redesigned dual tower maximizes performance and surface area by incorporating optimized fin density and thickness.
• 8 Heat Pipe Array: An optimized layout comprising of 8 heat pipes ensures efficient heat transfer across the entire fin area for effective dissipation.
• Expanded Copper Base: The expanded nickel-plated copper base ensures seamless contact and complete coverage, targeting all heat zones. Minimized base layer thickness enhances heat conductivity, reduces cooler height, and improves case compatibility.
• Dual Mobius Fans: Equipped with dual variable Mobius fans, providing exceptional silence without compromising performance.
• Maximum RAM Clearance: 120mm Mobius fan provides 42mm of RAM clearance to fit a wider range of builds without sacrificing performance.